Will Technology
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Wire Probe Jig
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Platform
- Wire probe head
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Key Features
- Rich probe line-up capable of responding to various customer requirements
Ultra fine pitch of 32㎛ (Min.)
Supports high-precision 4-terminal test
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Application
- FC-BGA, FC-CSP package substrate for CPU(PC/Server), GPU, Mobile AP, Memory, RF IC, etc.
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Platform
- Movable wire probe head
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Key Features
- Optimized for accurate and reliable testing of micro solder bump
Ultra fine pitch of 32㎛ (Min.)
Supports high-precision 4-terminal test
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Application
- FC-BGA, FC-CSP package substrate for CPU(PC/Server), GPU, Mobile AP, Memory, RF IC, etc.
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MEMS Probe Jig
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Platform
- MEMS vertical probe head
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Key Features
- High performance probe characteristics (Low resistance, Uniform spring motion)
Ultra fine pitch of 32㎛ (Min.)
Supports high-precision 4-terminal test
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Application
- FC-BGA, FC-CSP package substrate for CPU, GPU, Mobile AP, Memory, RF IC, etc.
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