Will Technology
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System IC
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Platform
- T6391[ND4] Φ440mm, ADVANTEST
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Key Features
- High parallelism over 16ea
Ultra fine pitch : 10/20㎛
High speed test over 6Gbps
Customized probe materials and characteristics (Pd, Pt Alloy, ReW, low force for Au bump)
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Application
- Display Driver IC wafer test
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Platform
- T6391[ND4] Φ440mm, ADVANTEST
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Key Features
- Supports various chip on film (COF) package standards
High parallelism over 3ea
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Application
- Display Driver IC COF package test
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Platform
- Diamond-X, COHU
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Key Features
- High parallelism over 16ea
Ultra fine pitch : 10/20㎛
High speed test over 6Gbps
Customized probe materials and characteristics (Pd, Pt Alloy, ReW, low force for Au bump)
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Application
- Display Driver IC wafer test
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Platform
- Ultra Flex XD Φ300mm, TERADYNE
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Key Features
- Fine pitch less than 40㎛
High parallelism over 16ea
ReW probe for Al pad test
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Application
- Flash controller, ASIC, other SoC etc.
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Platform
- T6373[ND3] Φ300mm, ADVANTEST
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Key Features
- High speed test over 4Gbps
Over 8ea parallelism
Customized probe materials and characteristics (Pd, Pt Alloy, ReW, low force for Au bump)
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Application
- Display Driver IC Wafer & COF Package
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Platform
- Magnum-SV, TERADYNE
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Key Features
- Over 512ea parallelism, High test productivity
Fine pitch less than 40㎛
ReW probe for Al pad test
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Application
- Smart IC, Other SoC
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Memory IC
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Platform
- Customer specifications
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Key Features
- Flexibility to meet customers’ diverse test platform and requirements
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Application
- High Band width Memory(HBM) development
For testing and analysis in the semiconductor development stage
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