윌테크놀러지

WILL Technology’s MEMS Vertical Probe Card boasts outstanding performance and reliability based on differentiated MEMS vertical probe core technology and industry-leading proven manufacturing technology.

Our MEMS Vertical Probe Card supports multi-parallel and large-scale simultaneous testing with more than 60,000 probes. It provides a variety of probe line-ups with 50~100㎛ pitches for each application and also provides test solutions optimized for customer requirements. In particular, it is optimized for testing the latest high-performance semiconductors such as Application Processors(AP) and HBM.

We implement a 3D MEMS Cantilever Probe Array using precision MEMS process technology that applies semiconductor manufacturing technology and boast excellent usability characteristics and reliability. This provides optimized performance for testing the latest CMOS Image Sensor and Memory semiconductors.

By maximizing the number of simultaneous inspection chips we can greatly improve the efficiency of our customers' wafer test and we are playing a leading role in the high-end MEMS Probe Card market for CMOS Image Sensor inspection.

Epoxy Cantilever Probe Card technology has proven its stability and reliability through decades of development and abundant experience. Based on more advanced design and manufacturing technology, it provides excellent flexibility to perfectly respond to various semiconductor test environments from multi-variety system semiconductors to memory semiconductors.

The ultra-fine pitch manufacturing technology of 10㎛, which is equivalent to 1/10 of the thickness of a hair, is recognized as the world's highest level technology and with abundant application design capabilities, it can effectively respond to various customer needs.

Socket Probe Card is a product that combines high-performance Probe Card technology for system semiconductor and Pogo Pin Probe Head technology used for testing semiconductor packages. It is used for Wafer Level Package Test of various system semiconductor.

We have long standing experience in system semiconductor Probe Card and advanced circuit design and structural design technology. Based on this, we provide an optimized solution that can perfectly meet the various customer requirements for semiconductor package testing.

IC Package PCB Test Jig is a probing test solution that uses ultra-precise vertical probe technology to efficiently performs the quality screening inspection of IC Package Substrate PCB which semiconductor chips are mounted.

We provide the optimal solutions to meet a wide range of customer needs through skilled probe technology and internalized laser and mechanical micro drilling technology. In addition, MEMS Jig technology that we have developed for the first time in the world supports high-performance and high-efficiency tests up to approximately 80㎛ pitch 4-terminal tests that are difficult to respond with existing wire probe technology.