Will Technology

MEMS Probe Manufacturing Service

基于在MEMS制程技术和各种合金材料方面累积的专业知识，我们快速且准确地制造并提供客户所需的客制化MEMS探针。

  • 2D MEMS probe manufacturing service

    • MEMS vertical probe, MEMS cantilever probe
    • Customer request design and process
    • Probe design, simulation and evaluation support

  • Probe materials

    • Ni-alloy, Pd-alloy, Au, Rh, Ag, Insulation coating

  • Batch manufacturing service for MEMS vertical probe head

    • Including probe, guide plate and assembly

  • Patterned wafer manufacturing service

    • Electrode patterns of various metals for testing and development purposes

Precision Micro Hole Drilling Service

我们拥有采用最新雷射微钻孔机和机械微钻孔机的超精密零件加工技术，并提供制造半导体检测用探针卡和各种探测检测设备所需之客制化微孔导板加工服务。

  • Laser micro hole drilling

    • Fine hole size: Min. 25㎛, 200㎛-thick
    • Rectangular hole, Circular hole, Other customer requests

  • Mechanical micro hole drilling

    • Fine hole size: Min. 30㎛, 200㎛-thick
    • Circular hole

  • Guide plate materials

    • Ceramic: Silicon nitride, Photoveel, Alumina, etc.
    • Engineering plastic: MDS-100, S-1000, R-820, PEEK, etc.

  • Application

    • Probe card, PCB electronic test jig, IC package test socket, etc.

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