Will Technology

  • System IC

      • Platform

          Ultra Flex Plus, TERADYNE

      • Key Features

          Ultra high pin count of over 60,000ea Multi-parallel, High test productivity Hybrid probe array for high effective CCC

      • Application

          Premium AP, AI Chip, Automotive

      • Platform

          V93000 Direct Dock, ADVANTEST XPS256 (VHD Pogo Block)

      • Key Features

          Ultra high pin count of over 40,000ea Multi-parallel, High test productivity Hybrid probe array for high effective CCC

      • Application

          Premium AP, GPU, CPU etc.

      • Platform

          Ultra Flex XD Φ440mm, TERADYNE

      • Key Features

          High pin count of over 20,000ea Hybrid probe array for high effective CCC Ultra fine pitch of 50㎛ or less

      • Application

          AP, Flash controller, ASIC etc.

      • Platform

          Ultra Flex XD Φ300mm, TERADYNE

      • Key Features

          Number of probes: ~10,000ea Hybrid probe array for high effective CCC Ultra fine pitch of 50㎛ or less

      • Application

          AP, Flash controller, ASIC, Logic etc.

  • Memory IC

      • Platform

          T5592 Φ300mm, ADVANTEST

      • Key Features

          Ultra fine pitch of 45㎛ or less Multi-parallel, High test productivity

      • Application

          High Band width Memory (HBM) Memory Semiconductor development test (DRAM, NAND Flash)

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