Contents
배경선이미지
메인으로 가기

Product

VPC

홈으로 PRODUCT > Vertical Type

윌테크놀러지의 vpc
윌테크놀러지의 첨단 기술

윌테크놀러지의 첨단 기술

This contributes to increase test efficiency and productivity by implementing parallel test function during a touch down on wafer and applying the design concept of minimizing damages on bumps or pads during wafer test with needles such as Cobra and POGO.
 It is widely applicable to chip test from car & industry robots until smart phone and consumer
IT products.

윌테크놀러지의 첨단 기술

윌테크놀러지의 첨단 기술

  • Used High density probe cards with more than 30k pins
  • Realized 8 parallel test probe cards
  • Applied POGO type and Cobra type pins
  • Implementing MLC and MLO substrates
  • Appiled Micro-Wire for Flip Chip Test

윌테크놀러지의 첨단 기술

  • Set-up inspection tools for FPC O/S
  • Enabled solutions for short lead time
  • Reduction of test cost using on the basis of high efficiency




Top